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Imodyuli yoBonelelo lwaMandla wokuSebenza okuphezulu TO-249

Inkcazelo emfutshane:

Iphakheji yeMveliso: TO-249

Intshayelelo: Ifomu yokupakisha ephezulu yangoku yeYunyi's Power Supply Module TO-249, usebenzisa i-high-purity, i-high-temperature epoxy resin yokupakisha, ukuphucula amandla omatshini kunye nokuxhathisa ukufuma, ukuqinisa ukuqina kunye nokuthembeka okuphezulu.I-chip ye-TO-249 Power Supply Module iziphuhlise kwaye iveliswe nguYunyi.Isetyenziswa kakhulu ekutshintsheni unikezelo lwamandla, isiguquli, ukhuseleko loqhagamshelo oluchasene nebhetri kunye nezinye izicelo


Iinkcukacha zeMveliso

Ixesha lokuphendula esweni

Uluhlu lokulinganisa

Iithegi zeMveliso

Izinto eziluncedo zeYUNYI's Imodyuli yoNikezo lwaMandla TO-249:

1. Iindleko zokukhuphisana nomgangatho ophezulu.

2. Ukusebenza okuphezulu kwemveliso kunye nexesha elifutshane lokuhamba.

3. Izinzile kwaye inokwethenjelwa phantsi kweendawo ezahlukeneyo zendalo.

4. Ubungakanani obuncinci, kunceda ukulungelelanisa indawo yebhodi yesiphaluka

UKUYA-249

Amanyathelo okwenziwa kweChip:

1. Ushicilelo ngoomatshini (Ushicilelo oluluqilima oluchanekileyo oluzenzekelayo)

2. Ukufakwa kokuQala okuzenzekelayo (IziXhobo zokuziQingela ngokuzenzekela, CPK>1.67)

3. Uvavanyo lwePolarity oluzenzekelayo (uVavanyo oluchanekileyo lwePolarity)

4. INdibano ezenzekelayo (iNdibano eZiphuhlisileyo echanekileyo)

5. Ukufakwa kweSoldering (Ukukhuselwa ngoMxube weNitrogen kunye neHydrogen Vacuum Soldering)

6. I-automatic Second-etching (I-Automatic Second-etching with Ultra-pure Water)

7. I-Automatic Gluing (i-Uniform Gluing & Calcuse Calculation iQinisekiswa yi-Automatic Precise Gluing Equipment)

8. Uvavanyo oluzenzekelayo lwe-Thermal (Ukhetho oluzenzekelayo nguMvavanyi we-Thermal)

9. Uvavanyo oluzenzekelayo (umvavanyi onemisebenzi emininzi)

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