Imodyuli yoBonelelo lwaMandla wokuSebenza okuphezulu TO-249
Izinto eziluncedo zeYUNYI's Imodyuli yoNikezo lwaMandla TO-249:
1. Iindleko zokukhuphisana nomgangatho ophezulu.
2. Ukusebenza okuphezulu kwemveliso kunye nexesha elifutshane lokuhamba.
3. Izinzile kwaye inokwethenjelwa phantsi kweendawo ezahlukeneyo zendalo.
4. Ubungakanani obuncinci, kunceda ukulungelelanisa indawo yebhodi yesiphaluka
Amanyathelo okwenziwa kweChip:
1. Ushicilelo ngoomatshini (Ushicilelo oluluqilima oluchanekileyo oluzenzekelayo)
2. Ukufakwa kokuQala okuzenzekelayo (IziXhobo zokuziQingela ngokuzenzekela, CPK>1.67)
3. Uvavanyo lwePolarity oluzenzekelayo (uVavanyo oluchanekileyo lwePolarity)
4. INdibano ezenzekelayo (iNdibano eZiphuhlisileyo echanekileyo)
5. Ukufakwa kweSoldering (Ukukhuselwa ngoMxube weNitrogen kunye neHydrogen Vacuum Soldering)
6. I-automatic Second-etching (I-Automatic Second-etching with Ultra-pure Water)
7. I-Automatic Gluing (i-Uniform Gluing & Calcuse Calculation iQinisekiswa yi-Automatic Precise Gluing Equipment)
8. Uvavanyo oluzenzekelayo lwe-Thermal (Ukhetho oluzenzekelayo nguMvavanyi we-Thermal)
9. Uvavanyo oluzenzekelayo (umvavanyi onemisebenzi emininzi)
Iiparamitha zeemveliso: