Imodyuli ye-T1 yoBonelelo lwaMandla ekumgangatho ophezulu

Umgangatho oPhezulu woBonelelo lwaMandla iModyuli T1 eFakelweyo Umfanekiso

Inkcazelo emfutshane:

Iphakheji yeMveliso: T1

Intshayelelo: Ifomu yokupakisha ephezulu yangoku, usebenzisa i-high-purity, i-high-temperature epoxy resin yokupakisha, ukuphucula amandla omatshini kunye nokuxhathisa ukufuma, ukuqinisa ukuqina kunye nokuthembeka okuphezulu.Isetyenziswa kakhulu ekutshintsheni unikezelo lwamandla, isiguquli, ukhuseleko loqhagamshelo oluchasene nebhetri kunye nezinye izicelo.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Ixesha lokuphendula esweni

Uluhlu lokulinganisa

Iithegi zeMveliso

Izinto eziluncedo zeYUNYI's Power Supply Module T1:

1. Iindleko zokukhuphisana nomgangatho ophezulu.

2. Ukusebenza okuphezulu kwemveliso kunye nexesha elifutshane lokuhamba.

3. Izinzile kwaye inokwethenjelwa phantsi kweendawo ezahlukeneyo zendalo.

4. Ubungakanani obuncinci, kunceda ukulungelelanisa indawo yebhodi yesiphaluka

Iinkqubo zokwenziwa kweChip:

1. Ushicilelo ngoomatshini (Ushicilelo oluluqilima oluchanekileyo oluzenzekelayo)

2. Ukufakwa kokuQala okuzenzekelayo (IziXhobo zokuziQingela ngokuzenzekela, CPK>1.67)

3. Uvavanyo lwePolarity oluzenzekelayo (uVavanyo oluchanekileyo lwePolarity)

4. INdibano ezenzekelayo (iNdibano eZiphuhlisileyo echanekileyo)

5. Ukufakwa kweSoldering (Ukukhuselwa ngoMxube weNitrogen kunye neHydrogen Vacuum Soldering)

6. I-automatic Second-etching (I-Automatic Second-etching with Ultra-pure Water)

7. I-Automatic Gluing (i-Uniform Gluing & Calcuse Calculation iQinisekiswa yi-Automatic Precise Gluing Equipment)

8. Uvavanyo oluzenzekelayo lwe-Thermal (Ukhetho oluzenzekelayo nguMvavanyi we-Thermal)

9. Uvavanyo oluzenzekelayo (umvavanyi onemisebenzi emininzi)

Iiparamitha:

Inombolo yendawo	Iphakheji	VRWM V	IO A	IFSM A	IR Ma	VF V	Trr ns
SM090KD800G1	T1	800	90	2000	0.02	1.05	-
SM090KE800G1	T1	800	90	2000	0.02	1.05	-
SM090KC800G1	T1	800	90	2000	0.02	1.05	-
SM090KJ800G1	T1	800	90	2000	0.02	1.05	-